ligitek electronics co.,ltd. property of ligitek only doc. no : qw0905- rev. : a date : - 2006 09 - feb. lmd5741/2bvg-xx lmd5741/2bvg-xx data sheet dot matrix digit led display (4.0inch)
note : 1.all dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. lmd5741/2bvg-xx part no. package dimensions ligitek electronics co.,ltd. property of ligitek only page1/7 5.08x6=30.48 (1.2") pin no.1 ? 0.8 typ 6.2 0.5 76.1 (2.996") 12.8(0.504") 15.16x6 =90.96 (3.581") 106.2 (4.181") 15.16x4=60.64 (2.387") lmd5741/2bvg-xx ligitek 10.0(0.394") 75.6(2.976")
lmd5741/2bvg-xx ligitek electronics co.,ltd. property of ligitek only internal circuit diagram part no.2/7 page 7 2 6 5 7 1 4 3 5,12 8 2 1 14 9 lmd5741bvg-xx 2 column row pin 13 1 3 4,11 310 4 6 5 2 7 6 7 5 1 5,12 4 3 8 2 14 9 1 pin row column 3 13 1 2 10 4,11 3 4 lmd5742bvg-xx 6 5
electrical connection ligitek electronics co.,ltd. property of ligitek only 3/7 page cathode column cathode column cathode column anode row anode row anode row anode row anode row 76 14 lmd5741bvg-xx 7 anode row 2 cathode column cathode column cathode column anode row 6 5 3 4 5 4 2 3 anode row pin no. 15 9 13 12 10 11 8 lmd5742bvg-xx 2 cathode row 7 6 1 4 1 4 3 3 cathode row 7 2 anode column anode column cathode row anode column 6 5 3 4 5 4 2 3 cathode row pin no. 15 cathode row 14 2 anode column anode column anode column cathode row cathode row cathode row 9 13 12 10 11 8 1 4 1 4 3 3 lmd5741/2bvg-xx part no.
common cathode or anode note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. part selection and application information(ratings at 25) lmd5742bvg-xx lmd5741bvg-xx part no gap green material emitted chip electrical max. 565304.25.2 3.4 (nm) p ( nm) min. typ. vf(v) 2:1 8.515.25 iv-m min. typ. iv(mcd) solder temperature 1/16 inch below seating plane for 3 seconds at 260 pd ir tstg t opr i f symbol i fp absolute maximum ratings at ta=25 forward current per chip power dissipation per chip reverse current per any chip peak forward current per chip (duty 1/10,0.1ms pulse width) storage temperature operating temperature parameter ma 30 -25 ~ +85 -25 ~ +85 100 10 120 mw a ma ligitek electronics co.,ltd. property of ligitek only vg ratings page4/7 unit lmd5741/2bvg-xx part no. common cathode common anode
test condition for each parameter luminous intensity per chip spectral line half-width reverse current any chip luminous intensity matching ratio peak wavelength forward voltage per chip parameter test condition iv-m ir a nm p iv vf symbol mcd nm volt unit if=20ma vr=5v if=10ma if=20ma if=20ma ligitek electronics co.,ltd. property of ligitek only 5/7 page lmd5741/2bvg-xx part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics cur v e forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -4040 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 vg chip 3.5 page6/7 lmd5741/2bvg-xx part no.
reliability test: test item high temperature storage test low temperature storage test operating life test high temperature high humidity test thermal shock test solder resistance test solderability test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=10ma 3.t=1000 hrs (-24hrs, +72hrs) test condition the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. description this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. page7/7 lmd5741/2bvg-xx part no.
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